3M™ hot melt adhesive 3731 delivers a strong, durable bond as a 100% solids, solvent free adhesive. We formulated this adhesive to maintain a durable, reliable bond through high heat resistance, providing you with exceptional performance for a wide range of applications. Engineered to deliver excellent results, 3M™ hot melt adhesive 3731 is a high heat-resistant adhesive that offers long term durability by withstanding elevated temperatures without lifting or deformation. This hot melt adhesive also bonds well to a variety of substrates and is an excellent candidates for bonding low surface energy (LSE) substrates, including polyethylene and polypropylene. In addition, 3M™ hot melt adhesive 3731 is fast setting, with an open bead time of 30 sec, presenting strong results and tough bonds within a short period of time. Designed to provide good peel strength, our hot melt adhesive 3731 creates a resilient bond that is long lasting, offering confidence and peace of mind for a wide range of applications. Hot melts are 100% solids thermoplastic resins. These adhesives are engineered to remelt after bonding if exposed to high enough temperatures. The advantages of hot melt adhesives is that, unlike mechanical fasteners and sealing tapes, they are virtually invisible between surfaces. Our hot melt adhesives liquefy when heated, quickly fill gaps and wet the bonding surface. When they are applied to a surface, they cool, harden and reach their bond strength within seconds. Due to their quick work life, you can move assemblies immediately upon application which eliminates the need for clamps, fixturing or additional drying time and energy. For a resilient, durable bond to meet your project needs, we designed 3M™ hot melt adhesive 3731 to not only create a tough bond, but provide this strong adhesion fast. We engineered our hot melt glue to be the adhesive solution you need that meets your demands and excels in performance.

Scotch-Weld™ Hot Melt Adhesive, High Heat-Resistant, 5/8 in Diameter, 8 in Length, Bonds To: ABS, Acrylic, Chipboard, Coated Cardboard, Paper, Polyethylene, Polypropylene and PVC, -20 to 280 deg F, 30 s Application Time, 24 hr Curing, Tan

• Solvent-free and 100% solids adhesive that provides strong bonds
• Adhesive that offers long term durability through high temperature resistance
• Thermoplastic adhesive that offers the capability to bond to low surface energy (LSE) substrates
• Fast setting for quick, efficient and effective results
• Provides good peel strength, creating tough and resilient bonds
• Dispensed with bulk application equipment
• Short open time
• 100% solids weight
• Polypropylene adhesive

• Brochure
• Scotch_Weld_021200_82610_Catalog.pdf
• Catalog
• Datasheet
• Datasheet-1
• 3M_021200_49140_SDS.pdf
• SDS
• SDS
• Scotch_Weld_021200_45271_Specification_Sheet.pdf
• Specification Sheet